The HPE ProLiant BL460c Gen10 is a half-height blade designed for HPE BladeSystem c3000 and c7000 enclosures, delivering up to dual Intel® Xeon® Scalable processors and up to 2 TB of HPE DDR4 SmartMemory. It powers both traditional and hybrid IT workloads—virtualization, big data, AI—and integrates with HPE OneView for automated provisioning and lifecycle management.
With advanced security by Silicon Root of Trust, TPM 2.0 support, runtime firmware validation and Secure Recovery, the BL460c Gen10 safeguards firmware integrity and data while offering flexible storage backplanes and dual FlexibleLOM slots for networking expansion.
| SKU | Processor | Memory | Drive Bays | I/O | Management |
|---|---|---|---|---|---|
| 863445-B21 | 1× Intel® Xeon® Silver 4108 (1.8 GHz/8-core) | 16 GB DDR4-2666 MT/s (1×16 GB) | 2× SFF hot-swap | 2× PCIe 3.0 slots, 2-port 10 GbE FlexibleLOM | iLO 5 |
| 863446-B21 | 2× Intel® Xeon® Gold 5120 (2.2 GHz/14-core) | 64 GB DDR4-2666 MT/s (4×16 GB) | 2× SFF hot-swap | P204b-i 12 Gb SAS, 2-port 10 GbE FlexibleLOM | iLO 5 |
| 863447-B21 | 2× Intel® Xeon® Gold 6140 (2.3 GHz/18-core) | 128 GB DDR4-2666 MT/s (4×32 GB) | 2× SFF hot-swap | P204b-i 12 Gb SAS FBWC, 2-port 20 GbE FlexibleLOM | iLO 5 |
| 863442-B21 | Configure-to-order (blade chassis only) | Up to 16 DIMMs (via chassis) | Up to 2× SFF hot-swap | 1× FlexibleLOM + 2× PCIe mezzanine slots | iLO 5 |
| 875938-B21 | TAA-compliant CTO (blade chassis only) | Up to 16 DIMMs (via chassis) | Up to 2× SFF hot-swap | 1× FlexibleLOM + 2× PCIe mezzanine slots | iLO 5 |
| Specification | Detail |
|---|---|
| Processor | Dual 1st/2nd Gen Intel® Xeon® Scalable (4–26 cores per CPU) |
| Memory | Up to 2 TB DDR4 SmartMemory (16 DIMMs) |
| Storage Bays | 2 × front hot-swap SAS/SATA or NVMe drives; 1 optional optical bay |
| Networking | 2 × FlexibleLOM (1/10/25 GbE) or 2 × 1 GbE FlexibleLOM default |
| Management | HPE iLO 5, HPE OneView integration |
| Security | Silicon Root of Trust, TPM 2.0, Runtime Firmware Validation, Secure Recovery |
| Expansion | 2 × PCIe 3.0 I/O slots; dual FlexibleLOM expanders |
| Form Factor | Half-height blade (c7000: 16/blade, c3000: 8/blade) |
| Enclosure Power | Shares redundant PSUs in chassis (up to 4) |
| Dimensions | 31.85 mm × 713.78 mm × 727.6 mm |